• RF Multilayer
    Introducing HT 1.5 Bonding Film
    HT 1.5 bonding film offers several unique features which make it ideally suited as a bonding agent for producing laminated stripline and multilayer packages using Taconic laminates:
  • Features Benefits
    Closely controlled melt point Predictable laminating cycle
    2.35 Dielectric constant Electrical properties of the package are nearly unaffected by the presence of the bonding film
    Low loss properties Same as above
    Chemically stable Process chemistries will not affect circuit integrety

    Recommended bonding temperature: 425°F (220°C)
    Maximum bonding temperature: 450°F (235°C)

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