Very Low Loss
Low Moisture Absorption
High Peel Strength
Uniform & Consistent DK
Taclamplus is a cost-effective, non-reinforced microwave substrate that can be used to create very low-loss struc-tures both with single dielectric layers and multiple layers.
Exceptional copper-foil adhesion allows small-feature resolution and the unique composition of the dielectric facilitates clean laser ablation for micro-via and component-cavity formation.
The use of metal-plate such as 1 mm copper helps maintain dimensional stability and provides a sound ground plane and heat-sink.